Product Details:
Composition | 50/50 Tin/Lead |
Usage/Application | For Soldering |
Usage | for Soldering Electronics |
Melting Point | 183 DegreeC |
Packaging Size | 1 Kg/Reel |
Temperature | 200 deg C |
Country of Origin | Made in India |
HIFLO Sn50Pb50 alloy is manufactured with virgin metals process through dross lowering treatments which create the purest, lowest drossing, high fluidity solder. The product is further enhanced with addition of minor metals.
Advantages of using Hiflo 50/50 Solder Bar & Sticks:
Less production cost
Minimizes drossing
Increases yield
Increases production speed
Decreases solder defects
Lower temperature
Reduces bridging
Decreases solder defects
Improves throughput
Better peel off at wave exit
Application:
HIFLO Sb50Pb50 alloy is the ideal product for all wave soldering systems including inert atmosphere equipment. The alloys high purity and fluidity reduces rework by minimizing bridging and other causes of defective joints and can be used at lower operating temperatures. Lowest defect rates and highest number of solder joints are achieved when used to solder surface mount technology.
Product Details:
Packaging Size | 500 gm |
Usage/Application | For Industrial Use |
Physical State | Liquid |
Country of Origin | Made in India |