Product Details:
Packaging Size | 1 L |
Packaging Type | Plastic Can |
Shelf Life | 36 Months |
Usage/Application | For Soldering |
Material Type | Liquid |
Material Composition | Liquid |
Country of Origin | Made in India |
Product Details:
Packaging Size | 500 gm |
Usage/Application | For Industrial Use |
Physical State | Liquid |
Weight | 500 gm |
Country of Origin | Made in India |
Solder Paste is a highly reliable metal alloy designed to act as an adhesive during soldering processes. When heated to its melting point, the components of the solder paste becomes molten and mixed, creating a strong intermetallic bond between electronic components and circuit boards. Its exceptional strength properties enable it to withstand the heat of soldering without becoming brittle, ensuring the integrity of the soldered joints even under demanding conditions.
One of the key advantages of using Hiflo’s Solder Paste is its longevity. Unlike other adhesives that may dry out over time, our solder paste remains consistently effective, providing extended shelf life and usability. Additionally, the solder paste effectively removes dirt and residue from the surfaces being soldered, promoting a robust and reliable bond. Acting as a flux agent, it enhances the bonding process during soldering, increasing conductivity and efficiency in the soldered connections.
We offer solder paste types 4, 5 & 6, optimized for medium-pitch applications, ensuring precise and consistent soldering results. For micro-pitch requirements, we have specialized solutions available, tailored to meet the most demanding soldering needs in electronics manufacturing. Our solder paste are carefully formulated to provide excellent wetting properties and consistent flow during the soldering process, delivering exceptional results in various applications.
Product Details:
Usage/Application | For Soldering |
Physical State | Solid |
Country of Origin | Made in India |
A special alloy technology is designed to reduce the dross formation in solder baths.
This is available in the form of Tabs and can be added to any solder bath.
They are available in two versions RoHS & Non RoHS.
These tabs melt and form a superficial film on the surface of the bath preventing oxidation.
They are normally consumed instead of the alloys present in the bath; hence they need to top up periodically