Solder Wires

Product Details:

Rosin-activated core wire is used in industrial soldering applications where the activated flux is required for bonding purposes.

Additional Information:

• Delivery Time: 1 DAY

Product Details:

HIFLO Sn63Pb37 alloy is manufactured with virgin metals process through dross lowering treatments which create the purest, lowest drossing, high fluidity solder. The product is further enhanced with addition of minor metals.

Advantages of using Hiflo 63/37 Solder Bar & Sticks:

Less production cost

Minimizes drossing

Increases yield

Increases production speed

Decreases solder defects

Lower temperature

Reduces bridging

Decreases solder defects

Improves throughput

Better peel off at wave exit

Application:

HIFLO Sb63Pb37 alloy is the ideal product for all wave soldering systems including inert atmosphere equipment. The alloys high purity and fluidity reduces rework by minimizing bridging and other causes of defective joints and can be used at lower operating temperatures. Lowest defect rates and highest number of solder joints are achieved when used to solder surface mount technology.

Product Details:

Solder Wire 60/40 available in Solid and Flux Cored Wire: Gloflo, Tip Booster, Water Soluble, Zero Halide & Zero Halogen, Urea, RMA, RA and No-Clean.

HIFLO Sn60Pb40 alloy is manufactured with virgin metals process through dross lowering treatments which create the purest, lowest drossing, high fluidity solder. The product is further enhanced with addition of minor metals.

Advantages of using Hiflo 60/40 Solder Bar & Sticks:
Less production cost
Minimizes drossing
Increases yield
Increases production speed
Decreases solder defects
Lower temperature
Reduces bridging
Decreases solder defects
Improves throughput
Better peel off at wave exit

Application:

HIFLO Sb60Pb40 alloy is the ideal product for all wave soldering systems including inert atmosphere equipment. The alloys high purity and fluidity reduces rework by minimizing bridging and other causes of defective joints and can be used at lower operating temperatures. Lowest defect rates and highest number of solder joints are achieved when used to solder surface mount technology.

 

 

Product Details:

Solder Wire 63/37 available in Solid and Flux Cored Wire: Gloflo, Tip Booster, Water Soluble, Zero Halide & Zero Halogen, Urea, RMA, RA and No-Clean.

HIFLO Sn63Pb37 alloy is manufactured with virgin metals process through dross lowering treatments which create the purest, lowest drossing, high fluidity solder. The product is further enhanced with addition of minor metals.

Advantages of using Hiflo 63/37 Solder Bar & Sticks:
Less production cost
Minimizes drossing
Increases yield
Increases production speed
Decreases solder defects
Lower temperature
Reduces bridging
Decreases solder defects
Improves throughput
Better peel off at wave exit

Application:
HIFLO Sb63Pb37 alloy is the ideal product for all wave soldering systems including inert atmosphere equipment. The alloys high purity and fluidity reduces rework by minimizing bridging and other causes of defective joints and can be used at lower operating temperatures. Lowest defect rates and highest number of solder joints are achieved when used to solder surface mount technology.

Product Details:

Solder Wire 50/50 available in Solid and Flux Cored Wire: Gloflo, Tip Booster, Water Soluble, Zero Halide & Zero Halogen, Urea, RMA, RA and No-Clean.

SAC305 is a lead-free alloy that contains 96.5% tin, 3% silver, and 0.5% copper. 

HIFLO SAC305,405,387 alloy is designed to be a lead-free substitute for Sn/Pb alloys in most electronics assembly soldering operations. To reduce dross formation, Copper content and improve the joints the product is further enhanced with the addition of minor elements.

ADVANTAGES
Very good drainage.
Best all-around lead-free alternative.
Proven in production use for electronics
manufacturing.
Enhanced wetting characteristics.
High yields and low dross generation.

APPLICATION
HIFLO SAC305,405,387 alloy is suitable for Lead free alloy wave soldering and surface mount applications for electronic assemblers. It is suited to single side and mixed technology boards. A solder pot temperature of 255 - 265°C is recommended with a contact time 2.3 - 3.5 seconds with suitable wave solder fluxes.

Product Details:

Solder Wire 50/50 available in Solid and Flux Cored Wire: Gloflo, Tip Booster, Water Soluble, Zero Halide & Zero Halogen, Urea, RMA, RA and No-Clean.

SAC0307 is a lead-free alloy comprised of 99.0% tin, 0.3% silver, 0.7% copper.

HIFLO SAC0307 alloy is designed to be a lead free substitute for Sn/Pb alloys in most electronics assembly soldering operations. To reduce dross formation and improve the joints the product is further enhanced with the addition of minor elements.

ADVANTAGES
Best all-around lead-free alterative.
Proven in production use for electronics manufacturing.
Lowest melting point high-tin, lead free alloy without undesirable additions.
Enhanced wetting characteristics.
High yields and low dross generation.

APPLICATION
HIFLO SAC 0307 is suitable for Lead free alloy wave soldering and surface mount applications for electronic assemblers. It is suited to single side and mixed technology boards. A solder pot temperature of 255-265°C is recommended with a contact time 2.3 - 3.5 seconds with suitable wave soldering fluxes.

Product Details:

Solder Wire 50/50 available in Solid and Flux Cored Wire: Gloflo, Tip Booster, Water Soluble, Zero Halide & Zero Halogen, Urea, RMA, RA and No-Clean.

HIFLO 99C is No-silver lead free alloy suitable for use as a replacement for Sn/Pb, SAC305 and other low silver alloys in wave soldering, selective soldering and rework processes. To reduce dross formation and improve the joints & wetting speed the product is further enhanced with the addition of minor elements.

ADVANTAGES
High yields and low dross generation.
Best all-around lead-free alternative.
Proven in production use for electronics manufacturing.
Lowers total cost of ownership. Excellent mechanical reliability.
Delivers good performance across different soldering processes.
Lowest melting point high-tin, lead free alloy without undesirable additions.
Enhanced wetting characteristics.

APPLICATION

HIFLO 99C is suitable for Lead free alloy wave soldering, selective soldering and reworking both through hole and surface mount components process. It is suited to single side relatively complex, dual and mixed technology boards. A solder pot temperature of 255-270°C is recommended with a contact time 2.3-3.5 seconds with suitable wave soldering fluxes.

Product Details:

Hiflo Tin Anode/ Granules / Balls/Bars are made from primary tin. Shape has been specially designed for surface treatment in order to increase the anodic surface, to avoid the bridging effect and to slide evenly in the bottom of the titanium baskets until it is completely dissolved.

FEATURES & ADVANTAGES

• Lowers total cost of ownership.
• We have eliminated the conflict minerals from our products. Our products use lead in extremely low amounts, allowing us to comply with the RoHS Directive.
• Our anodes are made of minute crystal particles of uniform diameter to allow electroplating at low voltages, thus contributing to energy saving.
• We use special manufacturing methods to keep the oxide content in our anodes low in order to suppress the contamination of plating liquid and reduce the electroplating cost.
• Excellent mechanical reliability.
• Delivers good performance across different plating processes. Delivers
• The minute crystal structure also prevents too many oxides from getting formed between the grain boundaries. When the tin content of the anode is ionized to melt into the plating liquid, the oxides that are not desirable to the plating film deposit are released into the plating liquid.

Product Details:

Solder Wire 50/50 available in Solid and Flux Cored Wire: Gloflo, Tip Booster, Water Soluble, Zero Halide & Zero Halogen, Urea, RMA, RA and No-Clean.

HIFLO SN100 is No-silver lead-free alloy suitable for use as a replacement for Sn/Pb, SAC305 and other low silver alloys in wave soldering, selective soldering and rework processes. To reduce dross formation and improve the joints & wetting speed the product is further enhanced with the addition of minor elements.

ADVANTAGES
High yields and low dross generation.
Best all-around lead-free alternative.
Proven in production use for electronics manufacturing.
Lowers total cost of ownership.
Excellent mechanical reliability.
Delivers good performance across different soldering processes.
Lowest melting point high tin lead free alloy without undesirable additions.
Enhanced wetting characteristics.

APPLICATION
HIFLO SN100 is suitable for Lead free alloy wave soldering, selective soldering and reworking both through hole and surface mount components process. It is suited to single side relatively complex, dual and mixed technology boards. A solder pot temperature of 255-270°C is recommended with a contact time 2.3-3.5 seconds with suitable wave soldering fluxes.

Product Details:

Solder Wires are available in both solid and flux-cored. Different fluxes are used for various soldering applications depending on alloys, the number of cores and thickness chosen. We offer both Pb-free and Sn/Pb Alloys. Flux plays a significant role in the bonding process. It removes oxides from metal surfaces. 

Additional Information:

• Delivery Time: 1 day

Product Details:

Solder Wires are available in both solid and flux-cored. Different fluxes are used for various soldering applications depending on alloys, the number of cores and thickness chosen. We offer both Pb-free and Sn/Pb Alloys.

Additional Information:

• Delivery Time: 1 Day
• Packaging Details: Carton box

Product Details:

Halogen-free cored wire is available for both Pb-free and Sn/Pb alloys. They comply with standard requirements of <1000 ppm of group 17 of the periodic table and commonly used in production and environmentally friendly products.

 

Benefits:

·                     Clear Residue

·                     Excellent Spreading

·                     Excellent Wettability

·                     Less Smoke and Odour

Additional Information:

• Delivery Time: 1 DAY

Product Details:

RMA is a mildly activated general-purpose wire solder used in applications requiring good activation enabling excellent tarnish/ oxide removal and leaves slight residues after soldering.

 

Benefits:

·                     Mild Active Flux

·                     Good wetting

·                     Good thermal transfer

·                     Less Residue

Additional Information:

• Delivery Time: 1 DAY
• Packaging Details: CARTON BOX

Product Details:

No Clean cored solder wire is used in electronic assemblies where the residues of the flux can remain in the solder joint. They do not possess any corrosive reactions after soldering.

 

Benefits:

·                     Clear Residue

·                     Low odour/fumes

·                     Enhanced Solder Tip Life

·                     Fast Wetting

Additional Information:

• Delivery Time: 1 day
• Packaging Details: Carton Box

Product Details:

These are water-soluble and halide-free cored wires which is readily soluble in water and are highly active and have extended cleaning times.

 

Benefits:

·                     Halide Free

·                     Excellent Reliability

·                     High-Temperature Applications

·                     Good Wetting

 

Additional Information:

• Delivery Time: 1 DAY
• Packaging Details: Carton Box

Product Details:

Solder Wires are available in both solid and flux-cored. Different fluxes are used for various soldering applications depending on alloys, the number of cores and thickness chosen. We offer both Pb-free and Sn/Pb Alloys. Flux plays a significant role in the bonding process. It removes oxides from metal surfaces. 

 

Our unique processing technologies and parameters provide uniformity and flux throughout the solder wire. Drawing ranges from 10mm to 0.3mm.

Additional Information:

• Delivery Time: 1 Day